A thermal-driven force-directed floorplanning algorithm for 3D ICs-Reference-Cited by-同舟云学术

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A thermal-driven force-directed floorplanning algorithm for 3D ICs

Published:2009-08 Issue: Volume: Page:
ISSN:
Container-title:2009 11th IEEE International Conference on Computer-Aided Design and Computer Graphics
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Author:

Huang Yun,Zhou Qiang,Cai Yici,Yan Haixia

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5234369/5246805/05246852.pdf?arnumber=5246852

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermally-Aware Multi-Core Chiplet Stacking;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28

2. A High-Precision Stochastic Solver for Steady-State Thermal Analysis with Fourier Heat Transfer Robin Boundary Conditions;Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design;2022-10-30

3. A survey of optimization techniques for thermal-aware 3D processors;Journal of Systems Architecture;2019-08

4. Thermal-Aware Floorplanning with Min-cut Die Partition for 3D ICs;ETRI Journal;2014-08-01

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