Author:
Cao Kun,Zhou Junlong,Wei Tongquan,Chen Mingsong,Hu Shiyan,Li Keqin
Subject
Hardware and Architecture,Software
Reference135 articles.
1. ITRS, International technology roadmap for semiconductors, http://www.itrs2.net, (2018).
2. Reliability and temperature constrained task scheduling for makespan minimization on heterogeneous multi-core platforms;Zhou;J. Syst. Software,2017
3. A. Agrawal, J. Torrellas, S. Idgunji, Xylem: enhancing vertical thermal conduction in 3D processor-memory stacks (2017) 546–559.
4. Routability-driven TSV-aware floorplanning methodology for fixed-outline 3-D ICs;Lin;IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.,2017
5. LEAD: an adaptive 3D-NoC routing algorithm with queuing-theory based analytical verification;Salamat;IEEE Trans. Comput.,2018
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