Advanced Burn-In - An Optimized Product Stress and Test Flow for Automotive Microcontrollers

Author:

He Chen

Publisher

IEEE

Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Automating the Generation of Programs Maximizing the Repeatable Constant Switching Activity in Microprocessor Units via MaxSAT;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-11

2. Enhancing Good-Die-in-Bad-Neighborhood Methodology with Wafer-Level Defect Pattern Information;2023 IEEE International Test Conference (ITC);2023-10-07

3. Automotive Semiconductor Test: Challenges and Solutions towards Zero Defect Quality;2023 45th Annual EOS/ESD Symposium (EOS/ESD);2023-10-02

4. A Power Supply Rejection Based Approach for Robust Defect Detection in Operational Amplifiers;2023 IEEE East-West Design & Test Symposium (EWDTS);2023-09-22

5. A New High-efficient Burn-in Screening Methodology Applied in Automotive Integrated Circuits Reliability;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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