Automotive Semiconductor Test: Challenges and Solutions towards Zero Defect Quality
Author:
Affiliation:
1. NXP Semiconductors,Austin,TX,USA,78735
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10287717/10287664/10287730.pdf?arnumber=10287730
Reference38 articles.
1. Targeted Custom High-Voltage Stress Patterns on Automotive Designs
2. Kernel Based Cluster Fault Analysis;sumikawa;US 9 891 267,2018
3. Cell-Aware Test integration towards achieving 0 DPPB on automotive designs;nikila;International Test Conference (ITC) poster PO21,2022
4. Wafer Level Stress: Enabling Zero Defect Quality for Automotive Microcontrollers without Package Burn-In
5. Beyond structural test, the rising need for system-level test
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1. Multi-transition delay test for improving the coverage of cell internal defects;IEICE Electronics Express;2024-08-10
2. A Novel Out-of-Control Action Plan (OCAP) for Optimizing Efficiency and Quality in the Wafer Probing Process for Semiconductor Manufacturing;Sensors;2024-08-07
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