Survey of High-Temperature Reliability of Power Electronics Packaging Components-Reference-Cited by-同舟云学术

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Survey of High-Temperature Reliability of Power Electronics Packaging Components

Published:2015-05 Issue:5 Volume:30 Page:2456-2464
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Khazaka R.,Mendizabal L.,Henry D.,Hanna R.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/6996060/06898839.pdf?arnumber=6898839

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