Tri-Gate Normally-Off AlN/GaN HEMTs With 2.36 W/mm of Power Density and 67.5% Power-Added-Efficiency at V d = 12 V
Author:
Affiliation:
1. School of Microelectronics and the State Key Discipline Laboratory of Wide Bandgap Semiconductor Technology, Xidian University, Xi’an, China
2. Enkris Semiconductor Inc., Suzhou, China
Funder
Fundamental Research Funds for the National Key Research and Development Project
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/55/10081123/10050875.pdf?arnumber=10050875
Reference33 articles.
1. Thermally Stable Enhancement-Mode GaN Metal-Isolator-Semiconductor High-Electron-Mobility Transistor With Partially Recessed Fluorine-Implanted Barrier
2. High RF Performance Enhancement-Mode Al2O3/AlGaN/GaN MIS-HEMTs Fabricated With High-Temperature Gate-Recess Technique
3. Large signal linearity enhancement of AlGaN/GaN high electron mobility transistors by device-level Vt engineering for transconductance compensation;joglekar;IEDM Tech Dig,0
4. High-Linearity AlGaN/GaN FinFETs for Microwave Power Applications
5. Gate-Recessed AlGaN/GaN Based Enhancement-Mode High Electron Mobility Transistors for High Frequency Operation
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1. Study on geometry-dependent n+-InGaN regrowth via MOCVD for AlN/GaN ohmic contact application;Journal of Vacuum Science & Technology B;2024-08-02
2. Novel T-Shaped Gate With Air Gap for AlGaN/GaN HEMTs on Silicon With High Johnson’s Figures of Merit;IEEE Transactions on Electron Devices;2024-05
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4. Normally-off AlN/GaN HEMTs with a DIBL of 1.15 mV/V for RF Applications;2023 18th European Microwave Integrated Circuits Conference (EuMIC);2023-09-18
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