Novel T-Shaped Gate With Air Gap for AlGaN/GaN HEMTs on Silicon With High Johnson’s Figures of Merit
Author:
Affiliation:
1. School of Electronic and Information Engineering, South China University of Technology, Guangzhou, China
2. Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Optoelectronics, Guangzhou, China
Funder
Science and Technology Plan Project of Guangdong Province
Science and Technology Development Special Fund Projects of Zhongshan City
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/16/10508280/10492855.pdf?arnumber=10492855
Reference32 articles.
1. Wide bandgap compound semiconductors for superior high-voltage unipolar power devices
2. Breakdown Enhancement and Current Collapse Suppression in AlGaN/GaN HEMT by NiOX/SiNX and Al2O3/SiNX as Gate Dielectric Layer and Passivation Layer
3. Electric Field Modulation in the Channel by Lateral Thickness Distribution of High-k Films Formed on GaN HEMTs to Improve Breakdown Voltage
4. Breakdown-Voltage-Enhancement Technique for RF-Based AlGaN/GaN HEMTs With a Source-Connected Air-Bridge Field Plate
5. AlInGaN/GaN HEMTs With High Johnson’s Figure-of-Merit on Low Resistivity Silicon Substrate
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