Cu pillar based Advanced Packaging, for large area & fine pitch heterogeneous devices-Reference-Cited by-同舟云学术

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Cu pillar based Advanced Packaging, for large area & fine pitch heterogeneous devices

Published:2020-09-15 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
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Author:

MANI Abdenacer AIT,CAICEDO Nohora,MILOUD-ALI Nadia,LEVY Francois,BERGER Frederic,MOURIER Thierry,CHAIRA Tarik,APHOZ Natacha R,BEDOIN Alexis,PERAY Patrick,FRANCOU Mireille,GUEUGNOT Alain,BOUTAFA Laura,HENRY David

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9229482/9229650/09229685.pdf?arnumber=9229685

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Isothermal aging and electromigration reliability of Cu pillar bumps interconnections in advanced packages monitored by in-situ dynamic resistance testing;Journal of Materials Research and Technology;2024-09

2. Feasibility study for high-aspect ratio copper pin mounting using particle dynamics simulation with stochastic approach;2024-05-03

3. Systematic prediction method for flip-chip bonding connectivity of ultra-large array infrared detector;Optics Express;2024-03-11

4. Epoxy Wetting Flow and Adhesion Mechanism within a Small Gap and Small Pitch Copper Pillar Structure;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

5. Methods for latent image simulations in photolithography with a polychromatic light attenuation equation for fabricating VIAs in 2.5D and 3D advanced packaging architectures;Microsystems & Nanoengineering;2021-05-25

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