Copper line topology impact on the SiOCH low-k reliability in sub 45nm technology node. From the time-dependent dielectric breakdown to the product lifetime
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/5164157/5173200/05173318.pdf?arnumber=5173318
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
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2. Variability-Aware Predictive Modeling of Line-to-Line Dielectric Reliability;IEEE Transactions on Electron Devices;2020-04
3. Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis;Integration;2020-01
4. Impact of Linewidth on Backend Dielectric TDDB and Incorporation of the Linewidth Effect in Full Chip Lifetime Analysis;IEEE Transactions on Semiconductor Manufacturing;2015-02
5. Current Understanding of BEOL TDDB Lifetime Models;ECS Journal of Solid State Science and Technology;2014-10-30
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