Semantic Autoencoder for Modeling BEOL and MOL Dielectric Lifetime Distributions
Author:
Affiliation:
1. University of Illinois Urbana-Champaign,Dept. of Electrical and Computer Engineering,Urbana,Illinois,USA
2. IBM Research Division,Vermont,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10117589/10117581/10117878.pdf?arnumber=10117878
Reference16 articles.
1. Weibull breakdown characteristics and oxide thickness uniformity
2. Gate oxides in 50 nm devices: thickness uniformity improves projected reliability
3. Copper line topology impact on the SiOCH low-k reliability in sub 45nm technology node. From the time-dependent dielectric breakdown to the product lifetime
4. New breakdown data generation and analytics methodology to address BEOL and mol dielectric TDDB process development and technology qualification challenges
5. New methodology for modelling MOL TDDB coping with variability
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