Connecting Chips With More Than 100 GHz Bandwidth
Author:
Funder
German BMBF
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Earth and Planetary Sciences,General Environmental Science
Link
http://xplorestaging.ieee.org/ielx7/9171629/9316332/09318762.pdf?arnumber=9318762
Cited by 27 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A 360 GHz Fully Integrated Differential Signal Source With 106.7 GHz Continuous Tuning Range in 90 nm SiGe:C BiCMOS;IEEE Transactions on Microwave Theory and Techniques;2024-08
2. A 3-D Heterogeneously Integrated Application of the RF-Module With Micro-Bump Filter and Embedded AiP at W-Band;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08
3. A Low-Loss DC-to-300 GHz InP/Si Interconnection Based on Wafer Level Packaging Using Chip-first/Facedown Process;2024 IEEE/MTT-S International Microwave Symposium - IMS 2024;2024-06-16
4. Advanced 3D Heterogenous Integration (3DHI) for High Frequency RF Applications;2024 IEEE Wireless and Microwave Technology Conference (WAMICON);2024-04-15
5. Nanopackaging for FutureG Solutions;IEEE Nanotechnology Magazine;2024-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3