Applications for GaAs and silicon integrated circuits in next generation wireless communication systems
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx1/4/9774/00466074.pdf?arnumber=466074
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Characterization and Modeling of Trapping Effects in GaAs Enhanced HEMT under High Input Dynamic Range;2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA);2022-10-28
2. High-Speed Electronic Semiconductor Devices;Optoelectronic Integrated Circuit Design and Device Modeling;2010-12-09
3. Performance study of mixed signal CMOS photoreceiver circuits;Optical Information Systems II;2004-10-22
4. Integration of air-gap transmission lines on doped silicon substrates using glass microbump bonding techniques;IEEE Transactions on Microwave Theory and Techniques;1998
5. New insight into subharmonic oscillation mode of GaAs power amplifiers under severe output mismatch condition;IEEE Journal of Solid-State Circuits;1997
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