Integration of air-gap transmission lines on doped silicon substrates using glass microbump bonding techniques-Reference-Cited by-同舟云学术

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Integration of air-gap transmission lines on doped silicon substrates using glass microbump bonding techniques

Published:1998 Issue:11 Volume:46 Page:1850-1855
ISSN:0018-9480
Container-title:IEEE Transactions on Microwave Theory and Techniques
language:
Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

Chuang J.C.P.,El-Ghazaly S.M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx4/22/15815/00734499.pdf?arnumber=734499

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Multi-Layered Air-Gap Transmission Line Design for CMOS-Compatible Millimeter-Wave ICs;2021 International Conference on IC Design and Technology (ICICDT);2021-09-15

2. Low-cost inverted line in silicon/glass technology for filter in the ka-band;IEEE Transactions on Microwave Theory and Techniques;2006-07

3. High-performance air-gap transmission lines and inductors for millimeter-wave applications;IEEE Transactions on Microwave Theory and Techniques;2002-12

4. High performance air gap transmission lines for millimeter wave applications;2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278)

5. Monolithic implementation of air-buried microstrip lines for high-density microwave and millimeter wave ICs;52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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