Stress-induced voiding under vias connected to wide Cu metal leads-Reference-Cited by-同舟云学术

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Stress-induced voiding under vias connected to wide Cu metal leads

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Container-title:2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320)
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Author:

Ogawa E.T.,McPherson J.W.,Rosal J.A.,Dickerson K.J.,Chiu T.-C.,Tsung L.Y.,Jain M.K.,Bonifield T.D.,Ondrusek J.C.,McKee W.R.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7825/21509/00996654.pdf?arnumber=996654

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