State of the Art Metal Deposition System for Advanced UBM, RDL and Fan-Out Wafer Level Packaging-Reference-Cited by-同舟云学术

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State of the Art Metal Deposition System for Advanced UBM, RDL and Fan-Out Wafer Level Packaging

Published:2022-06-20 Issue: Volume: Page:
ISSN:
Container-title:2022 China Semiconductor Technology International Conference (CSTIC)
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Author:

Goh Clinton¹,Wei Junqi¹,Koh Tuck Foong¹,Zhang Kang¹,Boh Kelvin¹,Tang Hannah¹,Hoerner Bridger¹

Affiliation:

1. Applied Materials Singapore Technology Pte Ltd.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9856647/9856709/09856818.pdf?arnumber=9856818

Reference6 articles.

1. Impact of Process Control on UBM/RDL Contact Resistance for Next-Generation Fan-Out Devices

2. FOWLP: Chip-Last or RDL-First

3. Advanced Preclean Chamber for Ubm/Rdl Contact Resistance Improvement in Advanced Node Packaging Application

4. UBM/RDL Deposition by PVD for FOWLP in High Volume Production

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimum Rc Control and Productivity Boost in Wafer-Level Packaging Enabled by High- Throughput UBM/RDL Technology;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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