0.35μm, 30V fully isolated and low-Ron nLDMOS for DC-DC applications
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6684693/6694389/06694454.pdf?arnumber=6694454
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A Source Segmented LDMOS Structure for Improving Single Event Burnout Tolerance Based on High-Voltage BCD Process;IEEE Transactions on Device and Materials Reliability;2024-03
2. Experiments of a Novel Low-Voltage LDMOS With Ultrashallow Low-Resistance Path Modulated by Bulk Superjunction;IEEE Transactions on Electron Devices;2024-01
3. A Physics-Based Compact Model for the Static Drain Current in Heterojunction Barrier CNTFETs—Part II: Scattering, High-Field Effects, and Model Verification;IEEE Transactions on Electron Devices;2024-01
4. Design and Simulation Optimization of an Ultra-Low Specific On-Resistance LDMOS Device;IEEE Journal of the Electron Devices Society;2024
5. Novel Si/SiC heterojunction lateral double-diffused metal oxide semiconductor field effect transistor with low specific on-resistance by super junction layer;Micro and Nanostructures;2022-08
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