Online Calculation of the Increase in Thermal Resistance Caused by Solder Fatigue for IGBT Modules

Author:

Hu ZhenORCID,Du Mingxing,Wei Kexin

Funder

Tianjin Natural Science Foundation of China

New Energy Vehicle Key Special Project of National Key Research and Development Plan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Cited by 52 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. An improved POD-Galerkin method for rapid prediction of three-dimensional temperature field for an IGBT module;International Communications in Heat and Mass Transfer;2024-03

2. Characterization on the thermal field inside IGBT cells during switching based on TCAD modeling and Thermoreflectance imaging;Microelectronics Journal;2023-12

3. Distributed Thermal Modeling for Power Devices and Modules With Equivalent Heat Flow Path Extraction;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-12

4. An IGBT Thermal Resistance Estimation Method Based on the Optimized Miller Voltage Measurement Circuit;2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS);2023-11-10

5. Ageing Bonding Wires Equivalent Resistance Change Law Based on Temperature Distribution Coefficient;2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS);2023-11-10

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