Performance of power dissipation on semiconductor module for different configuration of heat SINK with thermal pad-Reference-Cited by-同舟云学术

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Performance of power dissipation on semiconductor module for different configuration of heat SINK with thermal pad

Published:2024-07 Issue: Volume:201 Page:109045
ISSN:1290-0729
Container-title:International Journal of Thermal Sciences
language:en
Short-container-title:International Journal of Thermal Sciences

Author:

Salim Muhammad Razin^ORCID,Abas Aizat^ORCID,Lim Kah Hei,Abdullah Mohamad Nazir

Funder

Universiti Sains Malaysia

Publisher

Elsevier BV

Reference47 articles.

1. Experimental investigation of mixed convection and surface radiation heat transfer from protruding discrete heat sources mounted on a vertical channel;Hotta;Heat Tran. Res.,2018

2. Temperature influence on the accuracy of the transient dual interface method for the junction-to-case thermal resistance measurement;Deng;IEEE Trans. Power Electron.,2021

3. Online calculation of the increase in thermal resistance caused by solder fatigue for IGBT modules;Hu;IEEE Trans. Device Mater. Reliab.,2017

4. SSD Power Consumption and How It’s Managed - Sabrent.” Accessed: September. 25, 2023. [Online]. Available: https://sabrent.com/blogs/storage/ssd-power-consumption.

5. 3D study of convection-radiation heat transfer of electronic chip inside enclosure cooled by heat sink;Hassan;Int. J. Therm. Sci.,2021

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