Comparative Analysis of Temperature-induced Micro-scale Deformation of Package by Experiment and Finite Element Analysis-Reference-Cited by-同舟云学术

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Comparative Analysis of Temperature-induced Micro-scale Deformation of Package by Experiment and Finite Element Analysis

Published:2021-09-14 Issue: Volume: Page:
ISSN:
Container-title:2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhong Cheng,Li Chenglong,Peng Tao,Wang Yunxia,Li Gang,Zhu Pengli,Lu Jibao,Sun Rong,Wong China-Ping

Funder

National Key R&D Program of China

National Natural Science Foundation of China

Youth Innovation Promotion Association CAS

SIAT Innovation Program for Excellent Young Researchers

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9567715/9567716/09568063.pdf?arnumber=9568063

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interface StressAnalysis Based on Warpage Characterization in a Flip-Chip Package;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

2. Strain and Deformation of Flip Chip with Underfill at High Temperature: In-situ Characterization and Finite Element Analysis;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. A Study on Evaluating the Risk of Underfill Delamination During Thermal Cycling by Finite Element Analysis;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

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