Strain and Deformation of Flip Chip with Underfill at High Temperature: In-situ Characterization and Finite Element Analysis-Reference-Cited by-同舟云学术

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Strain and Deformation of Flip Chip with Underfill at High Temperature: In-situ Characterization and Finite Element Analysis

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhang Zhen'an¹,Zhong Cheng²,Peng Xu²,Li Gang²,Lu Jibao²,Sun Rong²,Peng Liang²,Zhu Pengli²

Affiliation:

1. Chinese Academy of Science Nano Science and Technology Institute University of Science and Technology of China,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen / Suzhou,China

2. Chinese Academy of Science,Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Shenzhen,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873204.pdf?arnumber=9873204

Reference14 articles.

1. A Mechanistic Study of Underfill Cracks by the Confocal-DIC Method

2. Digital image correlation for surface deformation measurement: historical developments, recent advances and future goals

3. The Complete Packaging Reliability Studies through One Digital Image Correlation System

4. Direct Measurements of Underfill Local Strain Using Confocal Microscopy and Digital Image Correlation

5. Comparative Analysis of Temperature-induced Micro-scale Deformation of Package by Experiment and Finite Element Analysis

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