Digital twin as a tool for evaluating and optimizing flow behavior in encapsulating proccesses
Author:
Affiliation:
1. Siemens AG TICE ELM-DE,Berlin,Germany,13629
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939468.pdf?arnumber=9939468
Reference14 articles.
1. On methods to reduce spurious currents within VOF solver frameworks. Part 1: a review of the static bubble/droplet
2. Underfill flow as viscous flow between parallel plates driven by capillary action
3. An analytical model for predicting the underfill flow characteristics in flip-chip encapsulation
4. The effect of gap height on non-Newtonian underfill flow in chip packaging: Experiments and simulations
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration;Micromachines;2023-09-30
2. A Study of Underfill Dispensing Patterns in Flip-Chip Packaging;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
3. Two-Phase Flow Simulation of Capillary Underfilling as a Design Tool for Heterogenous Integration;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
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