A novel hermetic encapsulation approach for the protection of electronics in harsh environments-Reference-Cited by-同舟云学术

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A novel hermetic encapsulation approach for the protection of electronics in harsh environments

Published:2022-09-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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Author:

Spanier Malte¹,Pawlikowski Jakub²,Ziesche Steffen³,Kappert Holger⁴,Ostmann Andreas²,Jagle Martin⁵,Schneider-Ramelow Martin²

Affiliation:

1. Center of Microperipheric Technical University Berlin,Berlin,Germany

2. Fraunhofer Institute for Reliability and Microintegration IZM,Berlin,Germany

3. Fraunhofer Institute for Ceramic Technologies and Systems IKTS,Dresden,Germany

4. Fraunhofer Institue Microelectronics Circuits and Systems Institute for IMS,Duisburg,Germany

5. Fraunhofer Institute for Physical Measurement Techniques IPM,Freiburg,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939521.pdf?arnumber=9939521

Reference11 articles.

1. Chip embedding technology for power applications

2. On-turbine multisensors based on Hybrid Ceramic Manufacturing Technology

3. Ostmann: Embedding Technology for manufacturing of High Density SiP;boettcher;Proc IMAPS Nordic,0

4. Characterization of multilayer ceramic based sensor solutions for on-turbine measurements;ziesche;IMAPS CICMT 2021,0

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Encapsulating commercial accelerometers with epoxy and fluoroelastomer for harsh hydrocarbon fluid environment;Scientific Reports;2023-11-13

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