On-turbine multisensors based on Hybrid Ceramic Manufacturing Technology
Author:
Affiliation:
1. 1Fraunhofer IKTS, Winterbergstraße 28 01277 Dresden, Germany
2. 2Fraunhofer IMS, Finkenstraße 61, 47057 Duisburg, Germany
3. 3Fraunhofer ILT, Steinbachstraße 15, 52074 Aachen
4. 4Fraunhofer IMWS, Walter-Hülse-Straße 1, 06120 Halle, Germany
Abstract
Publisher
IMAPS - International Microelectronics Assembly and Packaging Society
Link
http://meridian.allenpress.com/imaps-conferences/article-pdf/2019/HiTen/000107/2366886/2380-4491_2019_hiten_000107.pdf
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1. A novel hermetic encapsulation approach for the protection of electronics in harsh environments;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13
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