Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package
Author:
Affiliation:
1. Electronic Thermal Management ANSYS France,Montigny Le Bretonneux,France
2. Université Paris Nanterre,Laboratoire Thermique Interfaces Environnement,Ville d'Avray,France
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9950458/9950600/09950677.pdf?arnumber=9950677
Reference21 articles.
1. Multi-port Dynamic Compact Thermal Models of BGA Package using Model Order Reduction and Metaheuristic Optimization
2. Differential Evolution based Multiobjective Optimization-A Review
3. Latest developments of compact thermal modeling of system-in-package devices by means of Genetic Algorithm
4. Electronic board modeling by the means of DELPHI compact thermal model of components
5. Investigation on Steady-State and Transient Boundary Condition Scenarios for Optimizing the Creation of Multiport Surrogate Thermal Models
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Pareto based Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
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