Pareto based Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package
Author:
Affiliation:
1. ANSYS France, Montigny Le Bretonneux,France
2. Universite Paris Nanterre,Laboratoire Thermique Interfaces Environnement,Ville d'Avray,France
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10177286/10177494/10177518.pdf?arnumber=10177518
Reference25 articles.
1. Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package
2. Compact Thermal Models of Packages Used inConduction Cooled Applications;aranyosi;IEEE Trans Compon Packag Technolog,2000
3. Electronic board modeling by the means of DELPHI compact thermal model of components
4. Latest developments of compact thermal modeling of system-in-package devices by means of Genetic Algorithm
5. Differential Evolution based Multiobjective Optimization-A Review
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