Electronic board modeling by the means of DELPHI compact thermal model of components
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx7/6966886/6972478/06972491.pdf?arnumber=6972491
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. 高精度な半導体パッケージ向けコンパクト熱モデル構築に向けた検証と考察─表面実装型ディスクリートパワー半導体パッケージモデル作成のための要件─;Journal of The Japan Institute of Electronics Packaging;2024-01-01
2. Pareto based Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
3. Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28
4. Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization;Microelectronics Reliability;2018-08
5. Investigation on Steady-State and Transient Boundary Condition Scenarios for Optimizing the Creation of Multiport Surrogate Thermal Models;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-06
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