Analysis of the Performance of Different Packaging Technologies of SiC Power Modules during Power Cycling Test-Reference-Cited by-同舟云学术

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Analysis of the Performance of Different Packaging Technologies of SiC Power Modules during Power Cycling Test

Published:2023-09-27 Issue: Volume: Page:
ISSN:
Container-title:2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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Author:

Singh Bhanu Pratap¹,Choudhury Khaled Redwan²,Norrga Staffan¹,Kostov Konstantin³,Nee Hans-Peter¹

Affiliation:

1. KTH Royal Institute of Technology,Stockholm,Sweden

2. University of Warwick Coventry,UK

3. Research Institutes of Sweden,Stockholm,Sweden

Funder

Scan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10325669/10325677/10325878.pdf?arnumber=10325878

Reference13 articles.

1. Modelling the Lifetime of Heavy Wire-bonds in Power Devices – Concepts, Limitations and Challenges

2. Reliability of thick Al wire bonds in IGBT modules for traction motor drives

3. Reliability model for Al wire bonds subjected to heel crack failures

4. Determination of Rate- and Temperature Dependent Inelastic Material Data for Sintered Silver Die Attach and Simulative Implementation

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review on Power Cycling Reliability of SiC Power Device;Electronic Materials;2024-06-10

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