Determination of Rate- and Temperature Dependent Inelastic Material Data for Sintered Silver Die Attach and Simulative Implementation
Author:
Affiliation:
1. Vitesco Technologies Germany GmbH,Nuremberg,Germany
2. Chemnitz University of Technology,Chemnitz,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758877.pdf?arnumber=9758877
Reference25 articles.
1. Viscoplastic Anand model for solder alloys and its application
2. Determination of Anand constants for SAC solders using stress-strain or creep data
3. An Internal Variable Constitutive Model for the Hot Working of Metals;brown;PhD thesis,1987
4. Assimulo: A unified framework for ODE solvers
5. Mechanisches Verhalten der Werkstoffe
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Mechanical Characterization of Sintered Silver Materials for Power Device Packaging: A Review;Energies;2024-08-18
2. Analysis of the Performance of Different Packaging Technologies of SiC Power Modules during Power Cycling Test;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
3. Modelling Creep Behaviour in Sintered Silver using User-Programmable Features in ANSYS;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
4. Reliability and Lifetime Estimation of Sintered Silver Die Attach for Different Accelerated Testing Conditions;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3