Investigation of Thermal Design Issues of a Bimaterial MEMS
Author:
Affiliation:
1. Budapest University of Technology and Economics,Department of Electron Devices,Budapest,Hungary
Funder
Innovation Fund
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10325669/10325677/10325870.pdf?arnumber=10325870
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1. Examination of the CO/Pt/Cu layer structure with Kelvin probe and XPS analysis
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3. On the application of the vibrating Kelvin probe method for quality control of Cu(In,Ga)(Se,S)2thin-film solar modules
4. Modeling of an Optically Heated MEMS-Based Micromechanical Bimaterial Sensor for Heat Capacitance Measurements of Single Biological Cells
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