Evaluation of wafer bonded CMUTs with rectangular membranes featuring high fill factor-Reference-Cited by-同舟云学术

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Evaluation of wafer bonded CMUTs with rectangular membranes featuring high fill factor

Published:2008-09 Issue:9 Volume:55 Page:2053-2065
ISSN:0885-3010
Container-title:IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control
language:
Short-container-title:IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

Author:

Wong S.,Kupnik M.,Xuefeng Zhuang ,Der-song Lin ,Butts-Pauly K.,Khuri-yakub B.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation

Link

http://xplorestaging.ieee.org/ielx5/58/4626908/04626934.pdf?arnumber=4626934

Cited by 28 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Radiation Impedance of Rectangular CMUTs;Sensors;2024-09-07

2. Design and Fabrication of Micro Resonator With Bilateral Concentric Boundaries;IEEE Sensors Letters;2024-07

3. An Improved Static Membrane Deflection Analysis for Collapse Mode CMUT Fabricated by Sacrificial Release Method;IEEE Sensors Journal;2023-02-01

4. Outperforming piezoelectric ultrasonics with high-reliability single-membrane CMUT array elements;Microsystems & Nanoengineering;2022-06-02

5. Use of Supporting Post Width to Increase the CMUT’s Resonant Frequency;IEEE Access;2022

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