Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
11 articles.
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1. System Wireability;Modeling Microprocessor Performance;1998
2. Package Wiring and Terminals;Microelectronics Packaging Handbook;1997
3. Trends in silicon-on-silicon multichip modules;IEEE Design & Test of Computers;1993-12
4. Microwave characterization of microstrip lines and spiral inductors in MCM-D technology;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1992
5. Multichip packaging-a tutorial;Proceedings of the IEEE;1992