Deep Learning-Based Positioning Error Fault Diagnosis of Wire Bonding Equipment and an Empirical Study for IC Packaging-Reference-Cited by-同舟云学术

Deep Learning-Based Positioning Error Fault Diagnosis of Wire Bonding Equipment and an Empirical Study for IC Packaging

Published:2023-11 Issue:4 Volume:36 Page:619-628
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Kao Sheng-Xiang¹,Chien Chen-Fu²^ORCID

Affiliation:

1. International Intercollegiate Ph.D. Program, National Tsing Hua University, Hsinchu, Taiwan

2. Department of Industrial Engineering and Engineering Management, Artificial Intelligence for Intelligent Manufacturing Systems Research Center, National Science and Technology Council, Intelligent Manufacturing and Circular Economy Research Center, National Tsing Hua University, Hsinchu, Taiwan

Funder

National Science and Technology Council, Taiwan

ASE Group, Taiwan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/66/10299929/10041221.pdf?arnumber=10041221

Reference36 articles.

1. Key Techniques in Intelligent Predictive Maintenance (IPdM) – A Framework of Intelligent Faults Diagnosis and Prognosis System (IFDaPS)

2. Deep reinforcement learning for selecting demand forecast models to empower Industry 3.5 and an empirical study for a semiconductor component distributor