Author:
Wargulski Dan R.,May Daniel,Boschman Eef,Hutzler Aaron,Wunderle Bernhard,Ras Mohamad Abo
Cited by
4 articles.
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1. Pulsed infrared thermal imaging as inline quality assessment tool;Microelectronics Reliability;2023-03
2. Failure Analysis by Infrared and Thermoreflectance Imaging Applied on Active Devices;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28
3. Inline Failure Analysis of Sintered Layers in Power Modules using Infrared Thermography;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
4. Inline Tilt Measurements of Sintered Dies by Optical Line Scanning as Quality Assessment Tool for Smart Production;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25