Effect of process parameters on the surface morphology and mechanical performance of silicon structures after deep reactive ion etching (DRIE)-Reference-Cited by-同舟云学术

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Effect of process parameters on the surface morphology and mechanical performance of silicon structures after deep reactive ion etching (DRIE)

Published:2002-06 Issue:3 Volume:11 Page:264-275
ISSN:1057-7157
Container-title:Journal of Microelectromechanical Systems
language:en
Short-container-title:J. Microelectromech. Syst.

Author:

Kuo-Shen Chen ,Ayon A.A.,Xin Zhang ,Spearing S.M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://xplorestaging.ieee.org/ielx5/84/21730/01007405.pdf?arnumber=1007405

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