Author:
Yeong-Jyh Lin ,Sheng-Jye Hwang
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Experimental Study on Crack Propagation of Adhesive Layer Within Mini-LED Chips Needle-Ejecting Peeling-Off Transfer Mode;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05
2. Application of AI-enabled Simulation in Power Package Development;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
3. Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing;International Journal of Solids and Structures;2021-08
4. Vacuum-Based Picking-up and Placing-on;Modeling and Application of Flexible Electronics Packaging;2019
5. Single-needle Peeling;Modeling and Application of Flexible Electronics Packaging;2019