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Mechanics analysis of ultra-thin chip peeling from substrate under multi-needle-ejecting and vacuum-absorbing

  • Published:2021-08 Issue: Volume:224 Page:111009
  • ISSN:0020-7683
  • Container-title:International Journal of Solids and Structures
  • language:en
  • Short-container-title:International Journal of Solids and Structures

Author:

Chen Siyu,Lyu Wenhan,Wang Gang,Chen Ying,Ma Yinji,Feng Xue

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Competing behavior of interface delamination and wafer cracking during peeling film from ultra-thin wafer;International Journal of Solids and Structures;2024-12

2. Interfacial stress and crack propagation experimental study in mini-LED chip debonding;International Journal of Mechanical Sciences;2024-08

3. Experimental Study on Crack Propagation of Adhesive Layer Within Mini-LED Chips Needle-Ejecting Peeling-Off Transfer Mode;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05

4. Anti-Overturning Mechanism and Control Strategy In High-Speed Die Peeling-off Process;Proceedings of the 2023 6th International Conference on Robot Systems and Applications;2023-09-22

5. Dynamic peeling process of IC chip from substrate based on a 3D analytical model;International Journal of Solids and Structures;2023-09
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