Study in IC chip failure during pick-up process by using experimental and finite element methods

Author:

Cheng Tung-Hua,Du Chen-Chung,Tseng Ching-Huan

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference17 articles.

1. Takatori Corporation, Semiconductor Machinery Division/Introduction to the manufacturing process, http://www.takatori-g.co.jp/e_top.html (2003).

2. The stresses in cemented joints;Goland;ASME J. Appl. Mech.,1944

3. Finite element analysis of bonded connections;Carpenter;Int. J. Num. Mech. Eng.,1973

4. Bond thickness effects upon stresses in single-lap adhesive joints;Ojalvo;AIAA J.,1978

5. An analysis of adhesive-bonded single-lap joints;Chen;ASME J. Appl. Mech.,1983

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