Experimental Study on Crack Propagation of Adhesive Layer Within Mini-LED Chips Needle-Ejecting Peeling-Off Transfer Mode-Reference-Cited by-同舟云学术

Experimental Study on Crack Propagation of Adhesive Layer Within Mini-LED Chips Needle-Ejecting Peeling-Off Transfer Mode

Published:2024-05 Issue:5 Volume:14 Page:951-960
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Ma Li¹^ORCID,Chen Yanhui¹^ORCID,Chen Yun¹^ORCID,Chen Wanqun²,Chen Xin¹^ORCID,Hou Maoxiang¹^ORCID,Wong Ching-Ping³^ORCID,Niu Yan⁴,Yao Minghui⁴

Affiliation:

1. State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou, China

2. Suzhou Maxwell Technologies Company Ltd., Suzhou, China

3. School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA

4. School of Aeronautics and Astronautics, Tiangong University, Tianjin, China

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Basic and Applied Basic Research Foundation of Guangdong Province

Guangzhou Basic and Applied Basic Research Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/5503870/10538069/10495368.pdf?arnumber=10495368

Reference28 articles.

1. Mini‐LED backlight units on glass for 75‐inch 8K resolution liquid crystal display

2. Manipulating heat transport of photoluminescent composites in LEDs/LDs

3. A Novel Single X-Wire AM Mini-LED Backlight Unit with Motion Blur Reduction for High-Image-Quality LCD TVs

4. Uniformity improvement of a mini-LED backlight by a quantum-dot color conversion film with nonuniform thickness

5. LTPS TFT-Based Backlight Unit Using PWM Driving With Compensation for V _TH Variation and Voltage Rise in Power Line