Millimetre-wave Hot-Via interconnect-based GaAs chip-set for automotive RADAR and security sensors-Reference-Cited by-同舟云学术

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Millimetre-wave Hot-Via interconnect-based GaAs chip-set for automotive RADAR and security sensors

Published:2008-10 Issue: Volume: Page:
ISSN:
Container-title:2008 European Microwave Integrated Circuit Conference
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Author:

Alleaume PF.,Toussain C.,Auvinet C.,Domnesque D.,Quentin P.,Camiade M.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4757684/4772181/04772226.pdf?arnumber=4772226

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Approaches to Heterogeneous Integration for Millimeter-Wave Applications;Journal of the Russian Universities. Radioelectronics;2023-09-29

2. Demonstration of reproducible Millimeter-wave SMT Chip Scale Package using Hot-via MMICs and Plastic BGA Encapsulation;2021 51st European Microwave Conference (EuMC);2022-04-04

3. Optimised Hot-Via Transition with 20 dB Return Loss for MMIC Packaging from DC to 110 GHz;2021 51st European Microwave Conference (EuMC);2022-04-04

4. Millimeter-Wave Technology for Automotive Radar Sensors in the 77 GHz Frequency Band;IEEE Transactions on Microwave Theory and Techniques;2012-03

5. Integrated 79 GHz UWB automotive radar front-end based on Hi-Mission MCM-D silicon platform;International Journal of Microwave and Wireless Technologies;2010-07-07

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