Demonstration of reproducible Millimeter-wave SMT Chip Scale Package using Hot-via MMICs and Plastic BGA Encapsulation-Reference-Cited by-同舟云学术

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Demonstration of reproducible Millimeter-wave SMT Chip Scale Package using Hot-via MMICs and Plastic BGA Encapsulation

Published:2022-04-04 Issue: Volume: Page:
ISSN:
Container-title:2021 51st European Microwave Conference (EuMC)
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Author:

Bessemoulin A.¹,Marechal L.¹,Stieglauer H.²,Poilvert P.¹,Auxemery P.¹,Viaud J.P.¹

Affiliation:

1. United Monolithic Semiconductors S.A.S - Bât. Charmille,Villebon-sur-Yvette,France,91140

2. United Monolithic Semiconductors GmbH,Ulm,Germany,D-89081

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9784154/9783612/09784210.pdf?arnumber=9784210

Reference8 articles.

1. Millimetre-wave Hot-Via interconnect-based GaAs chip-set for automotive RADAR and security sensors

2. Hot-via interconnects: a step toward surface mount chip scale packaged MMICs up to 110 GHz

3. A Surface Mount 45 to 90 GHz Low Noise Amplifier Using Novel Hot-via Interconnection

4. Soldered hot-via E-band and W-band power amplifier MMICs for millimeter-wave chip scale packaging

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits;Materials;2023-10-17

2. Design Progress and Technology Maturity: Trends in Compound Semiconductor MMICs;2021 IEEE Asia-Pacific Microwave Conference (APMC);2021-11-28

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