Thermal Heat Path Signature of a Standard D2PAK Power Package by Transient Thermal Characterization and Modelling-Reference-Cited by-同舟云学术

Thermal Heat Path Signature of a Standard D2PAK Power Package by Transient Thermal Characterization and Modelling

Published:2022-04-25 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Sternberg Maik¹,Pareek Kaushal Arun¹,May Daniel¹,Ras Mohamad Abo¹,Wunderle Bernhard²

Affiliation:

1. Berliner Nanotest und Design GmbH,Berlin,Germany,12489

2. Chemnitz University of Technology,Chemnitz,Germany,09126

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758908.pdf?arnumber=9758908

Reference8 articles.

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2. A new evaluation method of thermal transient measurement results

3. Effect of Different Deconvolution Methods on Structure Function Calculation

4. Evaluation of short pulse thermal transient measurements

5. Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-Case of Semiconductor Devices with Heat Flow Through a Single Path;EIA/JEDEC Stand JESD51-14,2010

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