1. Tridiagonal Approaches for Network Identification by Deconvolution;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
2. Thermal Heat Path Signature of a Standard D2PAK Power Package by Transient Thermal Characterization and Modelling;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
3. Thermographic network identification for transient thermal heat path analysis;Quantitative InfraRed Thermography Journal;2022-02-07
4. On the Accuracy and Repeatability of Thermal Transient Measurements;Theory and Practice of Thermal Transient Testing of Electronic Components;2022
5. The Use of Thermal Transient Testing;Theory and Practice of Thermal Transient Testing of Electronic Components;2022