Studying Asymmetric Warpage Behavior of Panel-Level Packages Using Process Modeling Techniques and Viscoelasticity Theory
Author:
Affiliation:
1. Advanced Microsystem Packaging and Nano-Mechanics Research Lab
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100838.pdf?arnumber=10100838
Reference21 articles.
1. Preparation, curing kinetics, and properties of a novel low-volatile starlike aliphatic-polyamine curing agent for epoxy resins
2. Influence of fillers and additives on the cure kinetics of an epoxy/anhydride resin
3. Crystallization kinetics during polymer processing—Analysis of available approaches for process modeling
4. Curing kinetics study of epoxy resin/flexible amine toughness systems by dynamic and isothermal DSC
5. Prediction of Fan-Out Level Packaging Warpage using PSO-based Modified Convolutional Neural Network model with Laplacian Filter
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Simulation modeling of 600mm X600mm fan-out panel level for warpage behavior based on chip first;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. Simulation Modeling of 600mm X600mm Fan-Out Panel Level for Warpage Behavior Based on Chip First;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
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