Compact Module Integration Technologies for Millimeter Wave and Terahertz Applications-Reference-Cited by-同舟云学术

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Compact Module Integration Technologies for Millimeter Wave and Terahertz Applications

Published:2023-12-05 Issue: Volume:50 Page:763-765
ISSN:
Container-title:2023 Asia-Pacific Microwave Conference (APMC)
language:
Short-container-title:

Author:

Wu Peng¹,Chen Mingliang²,Yu Bo³,Wang Zhigang³

Affiliation:

1. Chinese Academy of Sciences,Aerospace Information Research Institute,Beijing,China

2. GBA Branch of Aerospace Information Research Institute,Chinese Academy of Sciences,Guangzhou,China

3. University of Electronic Science and Technology of China,School of Electronic Science and Enginering,Chengdu,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10439662/10439663/10439946.pdf?arnumber=10439946

Reference17 articles.

1. From active phased array antenna to antenna array microsystem in post-Moore era;Lu;Chinese Science F Series,2020

2. System in package (SiP) technology: fundamentals, design and applications

3. Design and Reliability Assessment of Novel 3D-IC Packaging

4. Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

5. Polymer Multichip Module Process Using 3-D Printing Technologies for D-Band Applications

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