Author:
Merkle Thomas,Gotzen Reiner,Choi Joo-Young,Koch Stefan
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Cited by
21 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Development of Microwave Components Using Additive Manufacturing: A Review;IETE Journal of Research;2024-06-17
2. A Fully Additive Manufactured D-Band SIW Antenna;2024 18th European Conference on Antennas and Propagation (EuCAP);2024-03-17
3. Compact Module Integration Technologies for Millimeter Wave and Terahertz Applications;2023 Asia-Pacific Microwave Conference (APMC);2023-12-05
4. Ultrawideband Chip-to-Chip Interconnect Using Bond Wire With Sidewalls;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12
5. Introduction;Active Array Antennas for High Resolution Microwave Imaging Radar;2023