Investigating Substrate Loss in MEMS Acoustic Resonators and On-Chip Inductors
Author:
Affiliation:
1. Department of Electrical and Computing Engineering, University of Illinois at Urbana–Champaign, Urbana, IL, USA
2. Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong
Funder
NSF Spectrum Efficiency, Energy Efficiency, and Security (SpecEES) Program
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation
Link
http://xplorestaging.ieee.org/ielx7/58/9782472/09759416.pdf?arnumber=9759416
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