Dual-Backplate CMUTs With Wide Bandwidth and Low Driving Voltage for Airborne Applications
Author:
Affiliation:
1. Department of Microsystems Engineering, University of Freiburg, Freiburg, Germany
2. Infineon Technologies AG, Neubiberg, Germany
Funder
Electronic Component Systems for European Leadership Joint Undertaking
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Acoustics and Ultrasonics,Instrumentation
Link
http://xplorestaging.ieee.org/ielx7/58/10287225/10234385.pdf?arnumber=10234385
Reference37 articles.
1. CMUTs for air coupled ultrasound with improved bandwidth
2. Designing transmitting CMUT cells for airborne applications;tasdelen;IEEE Trans Ultrason Ferroelectr Freq Control,2014
3. Capacitive micromachined ultrasonic transducers based on annular cell geometry for air-coupled applications
4. 50 kHz capacitive micromachined ultrasonic transducers for generation of highly directional sound with parametric arrays
5. Experimental evaluation of CMUTs with vented cavities under varying pressure
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