Monolithic 3D sequential integration realizing 1600-PPI red micro-LED display on Si CMOS driver IC
Author:
Affiliation:
1. KAIST,School of Electrical Engineering,Daejeon,Korea
2. KAIST,Infromation and Electronics Research Institute,Daejeon,Korea
3. Jasper Display Corp,California,USA
Funder
Samsung
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9830116/9830138/09830425.pdf?arnumber=9830425
Reference10 articles.
1. Light output performance of red AlGaInP-based light emitting diodes with different chip geometries and structures
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3. Emissive displays with transfer-printed assemblies of 8 μm × 15 μm inorganic light-emitting diodes
4. Wafer-scale monolithic hybrid integration of Si-based IC and III-V epi-layers-A mass manufacturable approach for active matrix micro-LED micro-displays
5. Investigation on reliability of red micro-light emitting diodes with atomic layer deposition passivation layers
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