FNNs Models for Regression of S-Parameters in Multilayer Interconnects with Different Electrical Lengths
Author:
Affiliation:
1. Instituto Tecnológico de Costa Rica,Cartago,Costa Rica
2. Institute of Computer Science, University of Tartu,Tartu,Estonia
3. Institut für Theoretische Elektrotechnik, Hamburg University of Technology,Hamburg,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10375531/10375532/10375594.pdf?arnumber=10375594
Reference13 articles.
1. SI/PI-Database of PCB-Based Interconnects for Machine Learning Applications
2. Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz
3. Effective Segmentation approach of Package-to-PCB modeling using Full-Wave EM field Solver
4. Equivalent Circuit Model of Lumped Elements Retrieved from Measured S-Parameters of Microstrip Line in Frequency Range 0.5-5GHz
5. Post-Silicon Receiver Equalization Metamodeling by Artificial Neural Networks
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