Author:
Rimolo-Donadio R.,Xiaoxiong Gu ,Kwark Y.H.,Ritter M.B.,Archambeault B.,de Paulis F.,Yaojiang Zhang ,Jun Fan ,Bruns H.-D.,Schuster C.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Cited by
93 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Hybrid Fast Modeling of Via-Connected Traces in Multilayer Electronic Packages;2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20
2. Dimensional Reduction by Auto-Encoders in Machine Learning Based Power Integrity Analysis;2024 IEEE 28th Workshop on Signal and Power Integrity (SPI);2024-05-12
3. PCB Based Power Delivery Network Analysis Using Transfer Learning and Artificial Neural Networks;2024 IEEE 28th Workshop on Signal and Power Integrity (SPI);2024-05-12
4. Application of Gaussian Process Regression for Data Efficient Prediction of PCB-Based Power Delivery Network Impedance Features;2024 IEEE 28th Workshop on Signal and Power Integrity (SPI);2024-05-12
5. Vulnerability Assessment of Integrated Circuits Through Electromagnetic-Circuit Cosimulation;IEEE Transactions on Electromagnetic Compatibility;2024